ALPHA ADVANCED MATERIALS trademarks under serial number 85360234. The goods are CONDUCTIVE AND INSULATING PASTE, FILM AND PELLET BASED ADHESIVES, COATINGS AND ENCAPSULANTS, NAMELY, SILICON, EPOXY AND ACRYLIC RESINS, USED AS STRUCTURAL ENCAPSULATION, BONDING AND/OR CONNECTING MATERIALS FOR THE ASSEMBLY OF COMPONENTS FOR MEDICAL OR ELECTRONIC BASED DEVICES AND ASSEMBLIES; INDUSTRIAL CHEMICALS, WATER SOLUBLE FLUXES, SOLVENT SOLUBLE FLUXES AND NO-CLEAN PASTE OR LIQUID FLUXES FOR USE IN THE MANUFACTURE AND ASSEMBLY OF SEMICONDUCTOR AND MICROELECTRONIC DEVICES AND ASSEMBLIES; CHE, SOLDERING MATERIALS CONTAINING METAL FOR USE IN THE MANUFACTURE AND ASSEMBLY OF SEMICONDUCTOR AND MICROELECTRONIC DEVICES AND ASSEMBLIES; WATER SOLUBLE AND NO CLEAN SOLDER PASTES, SOLDER SPHERES, SOLDER PREFORMS, SOLDER RIBBON, SOLID SOLDER WIRE, FLUX CORED SOLDER WIRE, SOLDER COATED METAL STRIP, AND SOLDERS COMPRISED PRIMARILY OF LEAD AND TIN FOR THE MANUFACTURE AND ASSEMBLY OF SEMICONDUCTOR AND MICROELECTRONIC DEVICES AND ASSEMBLIES; DISPENSER FILLED WITH WIRE SOLDER; BAR, WIRE AND CORE SOLDER. Currently that trademark is represented by trademark attorney(s): Midge M. Hyman.

ALPHA ADVANCED MATERIALS

USPTO Trademark Record · Serial No. 85360234

Trademark details

ALPHA ADVANCED MATERIALS is a trademark. Serial number of that application is 85360234.

It was initially claimed by ALPHA METALS, INC. on 20110630.

That brand applies to the following goods and services:CONDUCTIVE AND INSULATING PASTE, FILM AND PELLET BASED ADHESIVES, COATINGS AND ENCAPSULANTS, NAMELY, SILICON, EPOXY AND ACRYLIC RESINS, USED AS STRUCTURAL ENCAPSULATION, BONDING AND/OR CONNECTING MATERIALS FOR THE ASSEMBLY OF COMPONENTS FOR MEDICAL OR ELECTRONIC BASED DEVICES AND ASSEMBLIES; INDUSTRIAL CHEMICALS, WATER SOLUBLE FLUXES, SOLVENT SOLUBLE FLUXES AND NO-CLEAN PASTE OR LIQUID FLUXES FOR USE IN THE MANUFACTURE AND ASSEMBLY OF SEMICONDUCTOR AND MICROELECTRONIC DEVICES AND ASSEMBLIES; CHE, SOLDERING MATERIALS CONTAINING METAL FOR USE IN THE MANUFACTURE AND ASSEMBLY OF SEMICONDUCTOR AND MICROELECTRONIC DEVICES AND ASSEMBLIES; WATER SOLUBLE AND NO CLEAN SOLDER PASTES, SOLDER SPHERES, SOLDER PREFORMS, SOLDER RIBBON, SOLID SOLDER WIRE, FLUX CORED SOLDER WIRE, SOLDER COATED METAL STRIP, AND SOLDERS COMPRISED PRIMARILY OF LEAD AND TIN FOR THE MANUFACTURE AND ASSEMBLY OF SEMICONDUCTOR AND MICROELECTRONIC DEVICES AND ASSEMBLIES; DISPENSER FILLED WITH WIRE SOLDER; BAR, WIRE AND CORE SOLDER.

Currently that trademark is represented by trademark attorney(s): Midge M. Hyman.

You can learn more about that trademark on the USPTO website: View the USPTO record

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Consultation	Phone consultation/interview to begin preparation of a response and advise you on your issue. Further retained services will be reduced by this amount.	$400	Vary
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