FLIPCHIP INTERNATIONAL VENTURES
USPTO Trademark Record · Serial No. 78865082
Trademark details
It was initially claimed by FlipChip International LLC on 20060419.
That brand applies to the following goods and services:operation of technology of third parties, namely custom manufacture of products in the wafer bumping and wafer scale packaging semiconductor market, Development of new technology for third parties in the wafer bumping and wafer scale packaging semiconductor market; and technology consultation in the wafer bumping and wafer scale packaging semiconductor market.
Currently that trademark is represented by trademark attorney(s): Susan Daly Stearns.
You can learn more about that trademark on the USPTO website: View the USPTO record
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