ELITEFC
USPTO Trademark Record · Serial No. 78841899
Trademark details
It was initially claimed by FlipChip International, LLC on 20060321.
That brand applies to the following goods and services:Custom manufacture of semiconductor wafers and chips, namely, solder bumps on electroless metal under bump metallurgy incorporating the adherence of solder spheres to electroless metal on semiconductor wafers and chips.
Currently that trademark is represented by trademark attorney(s): John E. Cummerford.
You can learn more about that trademark on the USPTO website: View the USPTO record
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