RELIA-SUPERFILL
USPTO Trademark Record · Serial No. 77246823
Trademark details
It was initially claimed by eMAT Technology, LLC on 20070803.
That brand applies to the following goods and services:Chemicals for use in electrochemical metal deposition process to fabricate void-free damascene interconnects for integrated circuits, integrated circuit substrates, solar cells, flat panel displays, multi-chip modules, micro-electromechanical systems; precision analytical chemicals for use in analysis of chemicals in damascene interconnect plating.
Currently that trademark is represented by trademark attorney(s): Dax Alvarez.
You can learn more about that trademark on the USPTO website: View the USPTO record
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