CU.P BOND trademarks under serial number 76330816. The goods are Conductive interconnect on, and extending from, an integrated circuit or semiconductor wafer; flip chip interconnect; pillar bump or interconnect; integrated circuit interconnect, Manufacture for others, namely, forming conductive material on an integrated circuit or semiconductor wafer; semiconductor bumping services; electroplating conductive material on integrated circuits or semiconductor wafers; integrated circuit packaging services; pillar bumping services. Currently that trademark is represented by trademark attorney(s): Lawrence N. Ginsberg.

CU.P BOND

USPTO Trademark Record · Serial No. 76330816

Trademark details

CU.P BOND is a trademark. Serial number of that application is 76330816.

It was initially claimed by Advanpack Solutions Pte Ltd. on 20011029.

That brand applies to the following goods and services:Conductive interconnect on, and extending from, an integrated circuit or semiconductor wafer; flip chip interconnect; pillar bump or interconnect; integrated circuit interconnect, Manufacture for others, namely, forming conductive material on an integrated circuit or semiconductor wafer; semiconductor bumping services; electroplating conductive material on integrated circuits or semiconductor wafers; integrated circuit packaging services; pillar bumping services.

Currently that trademark is represented by trademark attorney(s): Lawrence N. Ginsberg.

You can learn more about that trademark on the USPTO website: View the USPTO record

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