ASSEMBLY TECHNOLOGIES
USPTO Trademark Record · Serial No. 74049649
Trademark details
It was initially claimed by General Signal Technology Corporation on 19900316.
That brand applies to the following goods and services:automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, namely the bonding of microelectronic circuit chips to lead frames and the electro-optical inspection of the finished product, programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices, automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, namely the bonding of microelectronic circuit chips to lead frames and the electro-optical inspection of the finished product, programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices, maintenance and repair services for automatic epoxy die attach equipment used in the manufacture of microelectronic circuits, namely the bonding of microelectronic circuit chips to lead frams and the electro-optical inspection of the finished product and programmable dicing saws used in the manufacture of microelectronic circuits and other high precision devices.
Currently that trademark is represented by trademark attorney(s): Harold Huberfeld.
You can learn more about that trademark on the USPTO website: View the USPTO record
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