HI-TEK
USPTO Trademark Record · Serial No. 73162765
Trademark details
It was initially claimed by Lamination Technology, Inc. on 19780320.
That brand applies to the following goods and services:Copper Clad Laminates Comprising an Insulative Substrate, Epoxy Resin and Outer Layers of Copper Foil.
Currently that trademark is represented by trademark attorney(s): Christie, Parker & Hale.
You can learn more about that trademark on the USPTO website: View the USPTO record
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