KS KULICKE & SOFFA trademarks under serial number 76328761. The goods are Dicing blades, namely, power-operated blades attached within dicing equipment to cut semiconductor wafers into individual integrated circuit chips; die attachment equipment, namely, semiconductor assembly equipment for picking up and placing individual silicon chips on a substrate and printed circuit board; [ solder ball placement equipment, namely, semiconductor assembly equipment used to place solder balls onto substrate material; ] wafer bumping equipment, namely, semiconductor assembly equip, Hand-operated wire bonding equipment, namely semiconductor assembly equipment for higher pitch wire bonding applications; hand-operated wire bonding tools used in the assembly of semiconductors, namely die collets, capillaries and wedge bonders, Computerized electrical wire bonding machine used in the assembly of semiconductors and wire bonding materials, namely, substrates with copper inlay, [ polymer materials, namely, wire encapsulants applied over wire bonds to lock individual wires in place prior to molding, ] and bonding wires; bonder software, namely, software used to run automated wire bonders attaching bonding wire from the integrated circuit chip to a substrate material; [ dicing equipment, namely, electrical dicing equipment, Providing on-line electronic commerce services, namely, on-line catalog for selection, [ ordering and payment ] of products and services, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment, dicing [ equipment and ] blades, factory automation products and services, [ electrical circuit substrates, ] manual wire bonding equipment, [ solder ball placement equipment, ] wafer bumping equipment, wafer bumping services, [ wafer preparation equipment, Maintenance and refurbishment of equipment used in back-end assembly of semiconductors, namely, integrated circuit ball bonders, wedge bonders, manual wire bonders, [ automated dicing equipment, ] ribbon bonders, stud bumpers, [ wafer preparation equipment, testing equipment and ball attachment equipment; ] on-line consulting and advisory services for said equipment maintenance and refurbishment, Providing on-line information regarding packaging trends in the field of back-end assembly of semiconductors; providing technical information in the back-end assembly of semiconductors; [ assembly services for others, namely, prototype building of mechanical components and printed circuit boards; and wafer bumping services for others, namely, semiconductor assembly services for placement of solder balls onto individual integrated electrical circuits ], Customer training in the use of equipment for back-end assembly of semiconductors; [ on-line consulting and advisory services for said training ], Providing on-line information regarding software developments in the field of semiconductor manufacturing; providing on-line information regarding technical packaging application support, namely, design of new bonding capillaries based on customer-specific capillary configurations; [ on-line design for others in the field of semiconductor packaging assembly, namely, semiconductor packaging product design application support for the development, testing and assembly of new electrical circuits, al. Currently that trademark is represented by trademark attorney(s): Kevin R. Casey.

KS KULICKE & SOFFA

USPTO Trademark Record · Serial No. 76328761

Trademark details

KS KULICKE & SOFFA is a trademark. Serial number of that application is 76328761.

It was initially claimed by KULICKE AND SOFFA INDUSTRIES, INC. on 20011024.

That brand applies to the following goods and services:Dicing blades, namely, power-operated blades attached within dicing equipment to cut semiconductor wafers into individual integrated circuit chips; die attachment equipment, namely, semiconductor assembly equipment for picking up and placing individual silicon chips on a substrate and printed circuit board; [ solder ball placement equipment, namely, semiconductor assembly equipment used to place solder balls onto substrate material; ] wafer bumping equipment, namely, semiconductor assembly equip, Hand-operated wire bonding equipment, namely semiconductor assembly equipment for higher pitch wire bonding applications; hand-operated wire bonding tools used in the assembly of semiconductors, namely die collets, capillaries and wedge bonders, Computerized electrical wire bonding machine used in the assembly of semiconductors and wire bonding materials, namely, substrates with copper inlay, [ polymer materials, namely, wire encapsulants applied over wire bonds to lock individual wires in place prior to molding, ] and bonding wires; bonder software, namely, software used to run automated wire bonders attaching bonding wire from the integrated circuit chip to a substrate material; [ dicing equipment, namely, electrical dicing equipment, Providing on-line electronic commerce services, namely, on-line catalog for selection, [ ordering and payment ] of products and services, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment, dicing [ equipment and ] blades, factory automation products and services, [ electrical circuit substrates, ] manual wire bonding equipment, [ solder ball placement equipment, ] wafer bumping equipment, wafer bumping services, [ wafer preparation equipment, Maintenance and refurbishment of equipment used in back-end assembly of semiconductors, namely, integrated circuit ball bonders, wedge bonders, manual wire bonders, [ automated dicing equipment, ] ribbon bonders, stud bumpers, [ wafer preparation equipment, testing equipment and ball attachment equipment; ] on-line consulting and advisory services for said equipment maintenance and refurbishment, Providing on-line information regarding packaging trends in the field of back-end assembly of semiconductors; providing technical information in the back-end assembly of semiconductors; [ assembly services for others, namely, prototype building of mechanical components and printed circuit boards; and wafer bumping services for others, namely, semiconductor assembly services for placement of solder balls onto individual integrated electrical circuits ], Customer training in the use of equipment for back-end assembly of semiconductors; [ on-line consulting and advisory services for said training ], Providing on-line information regarding software developments in the field of semiconductor manufacturing; providing on-line information regarding technical packaging application support, namely, design of new bonding capillaries based on customer-specific capillary configurations; [ on-line design for others in the field of semiconductor packaging assembly, namely, semiconductor packaging product design application support for the development, testing and assembly of new electrical circuits, al.

Currently that trademark is represented by trademark attorney(s): Kevin R. Casey.

You can learn more about that trademark on the USPTO website: View the USPTO record

Services available

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Statement of Actual Use for Your Trademark	Prepare and file a Statement of Actual Use for your Trademark with the USPTO.	$295	$150
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Trademark Renewal (Section 8 and Section 15 Affidavits; filed 5-6 year after registration) +Attorney of Record for 5 years, until next renewal	Prepare and File Trademark Renewal 5-6 year, including Section 8 Affidavit of Continuous Use; Section 15 Declaration of Incontestability, if applicable. +Attorney of Record for 5 years, until next renewal	$700	$575
Trademark Renewal 9-10 year+Attorney of Record for 10 years, until next renewal	Prepare and File Trademark Renewal 9-10 Year, including P Section 8 Affidavit of Continuous Use; Section 9 Application for Renewal. +Attorney of Record for 10 years, until next renewal	$700	$650
Response to Office Action - FREE estimate	Provide email with an estimated price for the response to the office action.	Vary	Vary
Consultation	Phone consultation/interview to begin preparation of a response and advise you on your issue. Further retained services will be reduced by this amount.	$400	Vary
All other issues	Phone consultation/interview to begin preparation of a response and advise you on your issue. Further retained services will be reduced by this amount.	$400	Vary
Estimate	Provide email with an estimated price for the requested service(s).	Vary	Vary
Licensing Agreement	Custom made trademark licensing or sharing agreements. From $600 -- request an estimate	$1,000	Vary
Assignment	Transfer of the trademark ownership. Assignments. From $400 -- request an estimate.	$400	$40

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