BLUELINE
USPTO Trademark Record · Serial No. 76214446
Trademark details
It was initially claimed by Cookson Electronics, Inc. on 20010222.
That brand applies to the following goods and services:Industrial adhesives, namely resin-based adhesives for attaching electronic components to circuit substrates, resin-based capillary underfill, resin-based no-flow underfill and resin-based water-level underfill, and electronic component packaging materials, namely resin-based transfer molding compound materials and resin-based encapsulant materials used to enclose or protect semiconductor devices, all for use in the manufacture of electronic component assemblies and radio frequency component ass, cleaning materials for use in removing flux residues from soldered assemblies, industrial and metal-based materials, namely laminates, solder, solder alloys, solder paste, solder flux and coated flux for use in the manufacture of electronic components assemblies and radio frequency component assemblies.
Currently that trademark is represented by trademark attorney(s): Stephen J. Holmes.
You can learn more about that trademark on the USPTO website: View the USPTO record
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